According to the BGA layout guidance, for 0.5mm pitch BGAs it is suggested to remove unused via pads on inner layers. https://jlcpcb.com/blog/bga-design-rules What is the minimum copper pour to drill-hole spacing for this on 6+ layer PCB with via-in-pad? And what is the minimum track to drill-hole spacing? Other pages state 0.2 mm but this wouldn't be compatible with routing on the inner layer as suggested in the BGA layout page. Example below with unused pads removed, and 0.12 mm hole to copper spacing in the photo.

Hello, I was wondering if you are able to do BGA with pitch 0.35 mm? I read that the minimum pad diameter is 0.25 mm, which leaves 0.1 mm between the individual pads. Is this still doable or too small?

【What is Via-in-Pad (VIP)?】 Traditionally, vias are placed away from component pads to avoid solder wicking. Via-in-Pad puts the via directly inside the SMD pad, plated and filled to create a flat, solderable surface. 【Why Use Via-in-Pad?】 Space Saver: Essential for BGA components with tight pitches where there’s no room for traditional "dog-bone" fan-outs. Better Thermal Management: Vias directly under components help dissipate heat much more efficiently. Signal Integrity: Reduces inductance and path length, perfect for high-frequency designs. 【The Big News from JLCPCB】 Usually, Via-in-Pad is an "expensive" premium service because it requires extra POVE (Plating Over Via Filled with Epoxy) steps. But here’s the kicker: JLCPCB is now offering FREE Via-in-Pad (POVE) for multi-layer boards (6-20 layers) to help engineers push the boundaries of compact design without breaking the bank! 【Design Specs to Remember】 Application: Best for BGAs and fine-pitch SMD components. Process: Epoxy filling + Copper capping (POVE) ensures no solder leakage and a perfectly flat pad. Eligibility: Check the 6+ layer board options during checkout to claim the $0 upgrade. #PCBDesign #HardwareEngineering #JLCPCB #ViaInPad

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【What is PCB Etching?】 In short, etching is the chemical or physical process of removing unwanted copper from a substrate to reveal your designed circuit pattern. It’s the "make or break" step in PCB manufacturing. 【Top 3 Etching Techniques Compared】 Wet Etching (The Industry Standard) 🧪 How it works: Uses chemical solutions (Acidic or Alkaline) to dissolve excess copper. Pros: Cost-effective, high speed, perfect for mass production. Cons: Risks "undercutting" (sideways etching), which can limit fine-line precision. Best for: Standard boards and inner layer circuits. Dry / Plasma Etching (The Precision Play) ⚡ How it works: Uses plasma gases in a vacuum to bombard the surface. Pros: Exceptional precision with zero liquid waste; no "undercutting" issues. Cons: Expensive equipment and slower throughput. Best for: High-density interconnect (HDI) boards and ultra-fine designs. Laser Etching (The Clean Alternative) 🎯 How it works: A high-energy laser beam "evaporates" copper directly. Pros: No chemicals needed; highly flexible for rapid prototyping. Cons: Not suitable for large-scale production due to cost and time. 【3 Tips for Engineers to Avoid Failure】 Mind the Undercut: Account for "Etch Factor" in your design to ensure your trace width remains accurate after chemical processing. Surface Preparation: Even a fingerprint can cause etching defects—cleanliness is key! Post-Etch Care: Ensure thorough rinsing and immediate surface finishing (like HASL or ENIG) to prevent copper oxidation. Join the Conversation: When designing high-speed circuits, which factor do you prioritize more: production cost or trace edge precision? Let’s discuss in the comments! #PCBDesign#ElectronicsEngineering #HardwareDesign#JLCPCB #Manufacturing#TechTips #PCB##JLCPCB#

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Slivers can peel off and cause short circuits or poor soldering. The Fix: Ensure minimum soldermask bridge width (usually 0.1mm) in your CAD settings. Working on a tight design? Our tech support can review your Soldermask clearance anytime. Just ask!

Teardrops prevent: Cracked traces during drilling. Signal bottlenecks at pad-to-trace joints. Stress concentration in high-density designs. Do you use teardrops by default? Let's discuss! 👇

Want to keep your project on budget? Stick to Standard Sizes: Stay within 100x100mm. Optimize Drill Sizes: Avoid micro-vias if possible. Standard Lead Times: Plan ahead to save on shipping. Have a complex design? Comment below for a free DFM optimization tip!

High-density SMT on a 0.11mm FPC? Challenge accepted. We just helped a client optimize this wristband layout for maximum durability and comfort. Working on something similar? Upload your design for a free DFM review from our technical support team!

Don't let your flexible circuits fail at the bend. Follow these: No Vias in the bend area. Smooth corner traces (no 90-degree angles). Use Teardrops for pad-to-trace transitions. What's your biggest FPC challenge? Ask our experts in the comments! 👇

FPC Gold Fingers PI Thickness Calculator Designing for a ZIF connector? Don't risk a loose connection! This tool helps you calculate the exact combination of base copper, adhesive, and PI stiffeners to meet connector specs. Best for: Ensuring your FPC fits perfectly into its socket. Try it here:FPC Thickness Calculator

Every month is a new chance to innovate! Whether it's a simple LED blinker or a complex drone controller, we want to see what you're building. Community Bonus: Did you know? From next month, every EasyEDA user gets $20 coupons every month upon file export. Finish your project. Export from EasyEDA. Claim your $10 PCB +$10 PCBA Coupon. Post a photo of your finished board here! What are you ordering with your coupon? Share your project below!

How to Calculate PCB Impedance in Seconds! Designing high-speed boards? Then you know that matching impedance is non-negotiable for signal integrity. Instead of manual math, use the JLCPCB Impedance Calculator. Simply input your layer stackup and trace width to get instant results. JLCPCB Impedance Calculator： https://jlcpcb.com/pcb-impedance-calculator

Choosing PCB thickness isn't just about aesthetics. If you're stuck between 1.0mm and 1.6mm, ask yourself these 4 questions: Mechanical Strength: Will it carry heavy transformers or heat sinks? (Go thicker >1.6mm) Housing Space: Is your enclosure ultra-slim? (Go thinner [removed]

FPCs are great because they are thin, but sometimes you need a little "backbone" for soldering components or inserting into connectors. At JLCPCB, we offer three main types of stiffeners: FR4: Best for providing rigid support under heavy SMT components. Polyimide (PI): Adds thickness for ZIF connector insertion without losing too much flexibility. Stainless Steel: The thinnest way to provide extreme rigidity and heat dissipation. Which stiffener do you prefer for wearable designs? Let's discuss!

Choosing the right surface finish is a critical decision that affects both the cost and the reliability of your assembly. Here’s a quick breakdown to help you decide for your next JLCPCB order: HASL (Hot Air Solder Leveling): The most cost-effective and traditional choice. Great for through-hole components, but the surface can be slightly uneven. ENIG (Electroless Nickel Immersion Gold): Perfect for fine-pitch SMT components and BGAs. It offers a flat surface, excellent oxidation resistance, and a long shelf life. Quick Tip: If your design has components with a pitch smaller than 0.5mm, go with ENIG to ensure high soldering yield! What's your "go-to" finish for prototypes? Let us know in the comments! #PCB#