Q: Could you confirm what is the minimal distance between two pads on flexible pcbs? Is it possible to have pads with 0.5 mm pitch? Thank you. A: We recommend 0.15mm at least between the pads(not pitch). There will be short circuit during soldering when it is less. #PCB#

Q: Hello, we have been struggling to properly panalize this design to pass JLCPCB requirements. The final finished product we need is shaped like this: Ideally the panel would create parts that are clean-break so there is no manual rework to cleanup burrs from mouse bites, but maybe that is not possible and we will have to do some clean up on the separated boards. We attempted to create a panel with a board outline like: But when panelized it failed audit because the slot region is too close to the board edge in 3 places: The suggestion from the audit is to increase the spacing between the slotted area and the board edge to at least 3mm. But that will make it very hard to break off to get the final shape. I think slotted regions can be very close (0.5mm) so maybe we could make the shape completely from slotted regions and just have a larger rectangular board outline. But would that cause the same weakness as having the slotted regions close to the board edge? Any suggestions on how to do this? Thanks! A: You could consider panel with v-cut since your board edge is flat. But it is still recommended to reduce the internal slot, to decrease the risk of board breaking. If the part on the left of the internal slot is the actual PCB you need, then we do not have better advice for panel format. #PCB#

Q: I have a IC with a large contact pad underneath it. The IC will consume a lot of power during operation, so it's highly desirable to increase the PCB area to accommodate it. I plan to use thermal vias in its center contact pad to connect to the ground plane underneath. I also plan to use a PCBA service to solder the IC to the board. Are there any recommendations for the geometry of the thermal vias or other considerations? A: Thermal vias can only be circular. Please confirm the number and arrangement of thermal vias according to actual needs. The diameter of thermal vias should not exceed 0.5mm. Epoxy filled&capped option is recommended, with a distance of ≥0.3mm between via edges. #PCB#

Q: I am looking for what material group according to UL would the FR-4, Nan Ya NP-140F, PCB boards have. I need this to calculate the minimum creepage distance for PCB traces according to voltage. A: All of our FR4 materials are UL 94 V-0. #PCB#

Q: I'm trying to order PCBs (FR-4, 2 layers), size 1000x60mm. The order is accepted with the HASL coating, but rejected with the ENIG coating. Does this that mean I can't order these PCBs with the ENIG coating? A: For 2-layer large PCB with dimension above 670*600mm, ENIG is not available. #PCB#

A: What is the minimum gap between two slots in pcb that you recommend? Q: 3-4mm would be fine. #PCB#

Q: I'd like to know if and how I can either combine multiple seperate PCBs in EasyEda into a single Gerber or how I can upload multiple Gerber files to JLCPCB that will be converted into a single PCB. A: Currently we do not provide such service to convert multiple gerber files into one PCB. It is probably not supported in EasyEDA too, but you could confirm with them via support@easyeda.com.#PCB#

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Q: JLCPCB edge plating guideline says this - "supply an annotated diagram showing which edges to plate". I have this edge plating annotation diagram ready. However, there is no place to actually include this diagram during the PCB order process in the JLCPCB website. So my question is, where to attach this edge plating annotation diagram? On a side note, I also included detailed fabrication notes (board dimensions, stackup, controlled impedance, drill summary, etc.) with my PCB and exported this with the Gerbers for JLCPCB, in case they have any questions. However, they mentioned that they would discard all these fabrication notes in an email. How do y'all send fabrication notes to JLCPCB? Is it not required? A: 1：Edge plating diagram For edge plating, you can directly design the plating area in the Gerber file (normally on a separate layer). When placing the order, please also add a remark such as “Edge plating as per the dedicated layer in the Gerber”. In addition, we strongly recommend selecting the option “Confirm Production File” during checkout, so our engineers can confirm with you before fabrication. 2: Fabrication notes (dimensions, stackup, impedance, drilling, etc.) Our engineers mainly follow the Gerber data for production. Other supplementary files in your compressed package (such as English notes, DXF, Excel, etc.) will not be referenced to avoid any conflict with the Gerber. Therefore, please ensure all required parameters are correctly defined in your Gerber files, as these will be used as the sole basis for manufacturing. ① Board dimensions: Just make sure the outline in the Gerber is correct. The website will also automatically recognize the size. If you find the detected size to be inaccurate, you can include the correct dimension in the remarks. ② Stackup: You can select the required stackup when placing the order. For impedance-related designs, you may refer to our impedance calculator to choose the most suitable stackup: https://jlcpcb.com/pcb-impedance-calculator. ③ Controlled impedance: By default, impedance tolerance is ±20%. If you require tighter control (±10%), please contact our online customer service or email our support team (support@jlcpcb.com) to enable the whitelist option. Once enabled, you can select ±10% tolerance. Please also include the impedance details (trace width/spacing, layer location, etc.) directly in the Gerber package and mention in the remarks where this information can be found. ④Drilling: Please design drills in the drill layer. Supplying a drill drawing file in the Gerber package is also recommended. Overall, as long as your Gerber files are designed clearly, no extra documentation is needed. But for special requirements, remarks + confirm production file are the most effective way to ensure your instructions are followed. #JLCPCB#

JLCPCB strictly adheres to IPC Class 2 and above standards on FPC. Some customers require stricter visual controls, so JLCPCB offers a Superb Quality Appearance option with the following criteria: || || |Superb Quality Appearance Assurance|Exceptions| |No wrinkles in the areas over the coverlay.|Wrinkles are permitted in areas without coverlay.| |No carbon powder on the board edge of common designs.|When selecting the laser cutting option, carbon powder is unavoidable if pads or large copper pours or 3M tape are close to or beyond the edge. Punching is recommended for such circumstances.| |No scratches, repairs, or exposed copper under visual inspection.|Imperfections only visible under magnification should be accepted.| |Oxidation and bubble areas are no more than 5% of the total board area.|| #JLCPCB#

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According to the BGA layout guidance, for 0.5mm pitch BGAs it is suggested to remove unused via pads on inner layers. https://jlcpcb.com/blog/bga-design-rules What is the minimum copper pour to drill-hole spacing for this on 6+ layer PCB with via-in-pad? And what is the minimum track to drill-hole spacing? Other pages state 0.2 mm but this wouldn't be compatible with routing on the inner layer as suggested in the BGA layout page. Example below with unused pads removed, and 0.12 mm hole to copper spacing in the photo.

Hello, I was wondering if you are able to do BGA with pitch 0.35 mm? I read that the minimum pad diameter is 0.25 mm, which leaves 0.1 mm between the individual pads. Is this still doable or too small?

【What is Via-in-Pad (VIP)?】 Traditionally, vias are placed away from component pads to avoid solder wicking. Via-in-Pad puts the via directly inside the SMD pad, plated and filled to create a flat, solderable surface. 【Why Use Via-in-Pad?】 Space Saver: Essential for BGA components with tight pitches where there’s no room for traditional "dog-bone" fan-outs. Better Thermal Management: Vias directly under components help dissipate heat much more efficiently. Signal Integrity: Reduces inductance and path length, perfect for high-frequency designs. 【The Big News from JLCPCB】 Usually, Via-in-Pad is an "expensive" premium service because it requires extra POVE (Plating Over Via Filled with Epoxy) steps. But here’s the kicker: JLCPCB is now offering FREE Via-in-Pad (POVE) for multi-layer boards (6-20 layers) to help engineers push the boundaries of compact design without breaking the bank! 【Design Specs to Remember】 Application: Best for BGAs and fine-pitch SMD components. Process: Epoxy filling + Copper capping (POVE) ensures no solder leakage and a perfectly flat pad. Eligibility: Check the 6+ layer board options during checkout to claim the $0 upgrade. #PCBDesign #HardwareEngineering #JLCPCB #ViaInPad

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【What is PCB Etching?】 In short, etching is the chemical or physical process of removing unwanted copper from a substrate to reveal your designed circuit pattern. It’s the "make or break" step in PCB manufacturing. 【Top 3 Etching Techniques Compared】 Wet Etching (The Industry Standard) 🧪 How it works: Uses chemical solutions (Acidic or Alkaline) to dissolve excess copper. Pros: Cost-effective, high speed, perfect for mass production. Cons: Risks "undercutting" (sideways etching), which can limit fine-line precision. Best for: Standard boards and inner layer circuits. Dry / Plasma Etching (The Precision Play) ⚡ How it works: Uses plasma gases in a vacuum to bombard the surface. Pros: Exceptional precision with zero liquid waste; no "undercutting" issues. Cons: Expensive equipment and slower throughput. Best for: High-density interconnect (HDI) boards and ultra-fine designs. Laser Etching (The Clean Alternative) 🎯 How it works: A high-energy laser beam "evaporates" copper directly. Pros: No chemicals needed; highly flexible for rapid prototyping. Cons: Not suitable for large-scale production due to cost and time. 【3 Tips for Engineers to Avoid Failure】 Mind the Undercut: Account for "Etch Factor" in your design to ensure your trace width remains accurate after chemical processing. Surface Preparation: Even a fingerprint can cause etching defects—cleanliness is key! Post-Etch Care: Ensure thorough rinsing and immediate surface finishing (like HASL or ENIG) to prevent copper oxidation. Join the Conversation: When designing high-speed circuits, which factor do you prioritize more: production cost or trace edge precision? Let’s discuss in the comments! #PCBDesign#ElectronicsEngineering #HardwareDesign#JLCPCB #Manufacturing#TechTips #PCB##JLCPCB#

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Slivers can peel off and cause short circuits or poor soldering. The Fix: Ensure minimum soldermask bridge width (usually 0.1mm) in your CAD settings. Working on a tight design? Our tech support can review your Soldermask clearance anytime. Just ask!

Teardrops prevent: Cracked traces during drilling. Signal bottlenecks at pad-to-trace joints. Stress concentration in high-density designs. Do you use teardrops by default? Let's discuss! 👇

Want to keep your project on budget? Stick to Standard Sizes: Stay within 100x100mm. Optimize Drill Sizes: Avoid micro-vias if possible. Standard Lead Times: Plan ahead to save on shipping. Have a complex design? Comment below for a free DFM optimization tip!

High-density SMT on a 0.11mm FPC? Challenge accepted. We just helped a client optimize this wristband layout for maximum durability and comfort. Working on something similar? Upload your design for a free DFM review from our technical support team!

Don't let your flexible circuits fail at the bend. Follow these: No Vias in the bend area. Smooth corner traces (no 90-degree angles). Use Teardrops for pad-to-trace transitions. What's your biggest FPC challenge? Ask our experts in the comments! 👇

FPC Gold Fingers PI Thickness Calculator Designing for a ZIF connector? Don't risk a loose connection! This tool helps you calculate the exact combination of base copper, adhesive, and PI stiffeners to meet connector specs. Best for: Ensuring your FPC fits perfectly into its socket. Try it here:FPC Thickness Calculator

Every month is a new chance to innovate! Whether it's a simple LED blinker or a complex drone controller, we want to see what you're building. Community Bonus: Did you know? From next month, every EasyEDA user gets $20 coupons every month upon file export. Finish your project. Export from EasyEDA. Claim your $10 PCB +$10 PCBA Coupon. Post a photo of your finished board here! What are you ordering with your coupon? Share your project below!

How to Calculate PCB Impedance in Seconds! Designing high-speed boards? Then you know that matching impedance is non-negotiable for signal integrity. Instead of manual math, use the JLCPCB Impedance Calculator. Simply input your layer stackup and trace width to get instant results. JLCPCB Impedance Calculator： https://jlcpcb.com/pcb-impedance-calculator

Choosing PCB thickness isn't just about aesthetics. If you're stuck between 1.0mm and 1.6mm, ask yourself these 4 questions: Mechanical Strength: Will it carry heavy transformers or heat sinks? (Go thicker >1.6mm) Housing Space: Is your enclosure ultra-slim? (Go thinner [removed]

FPCs are great because they are thin, but sometimes you need a little "backbone" for soldering components or inserting into connectors. At JLCPCB, we offer three main types of stiffeners: FR4: Best for providing rigid support under heavy SMT components. Polyimide (PI): Adds thickness for ZIF connector insertion without losing too much flexibility. Stainless Steel: The thinnest way to provide extreme rigidity and heat dissipation. Which stiffener do you prefer for wearable designs? Let's discuss!

Choosing the right surface finish is a critical decision that affects both the cost and the reliability of your assembly. Here’s a quick breakdown to help you decide for your next JLCPCB order: HASL (Hot Air Solder Leveling): The most cost-effective and traditional choice. Great for through-hole components, but the surface can be slightly uneven. ENIG (Electroless Nickel Immersion Gold): Perfect for fine-pitch SMT components and BGAs. It offers a flat surface, excellent oxidation resistance, and a long shelf life. Quick Tip: If your design has components with a pitch smaller than 0.5mm, go with ENIG to ensure high soldering yield! What's your "go-to" finish for prototypes? Let us know in the comments! #PCB#