Q:

I have a IC with a large contact pad underneath it. The IC will consume a lot of power during operation, so it's highly desirable to increase the PCB area to accommodate it. I plan to use thermal vias in its center contact pad to connect to the ground plane underneath.

I also plan to use a PCBA service to solder the IC to the board.

Are there any recommendations for the geometry of the thermal vias or other considerations?

A:

  1. Thermal vias can only be circular.
  2. Please confirm the number and arrangement of thermal vias according to actual needs.
  3. The diameter of thermal vias should not exceed 0.5mm. Epoxy filled&capped option is recommended, with a distance of ≥0.3mm between via edges.

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